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used semiconductor equipment

CVC 611 Sputtering System, currently configured for 8”
Sputter up configuration
Capability to process 6” wafers by using substrate adapter ring

The lockload and automatic handling was designed for 6” substrates

The automatic loading software does not work
Unit can be manually loaded
Substrates are loaded by venting the process chamber and opening the top lid Process Chamber Heaters
Single Process Chamber
Ion Mill

Two Process Targets
a. 3 kW 8” RF Target
b. 5 kW DC Target

Techware System Controller
(Qty 3) Mass flow controllers to support 3 process gases
(Qty 1) Cryogenic Pump
RF Bias, but does not work
Process Gas Pressure Range is 3-20 mT

Some spare parts are available
Currently installed and in operation on a daily basis

price is negotiable

Fully Refurbished
~1996 vintage.

CVC Loadlock 611 Sputtering System
 
Price: CALL
Ref# 35522mk

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