KLA-Tencor / Prometrix SpectraMap Auto SM300 Film Thickness Mapping System
KLA-Tencor / Prometrix SpectraMap Auto SM300 Film Thickness Mapping System
Description: A film thickness mapping system, accomodates wafers up to 200mm (8") with a measurement range of 400 - 800nm.
KLA-TENCOR PROMETRIX AUTO SM300 FEATURES / SPECIFICATIONS:
The SpectraMap Auto SM300 Film Thickness Mapping System is a highly
advanced measurement system used for film thickness process control in
a semiconductor fab. This system collects and analyzes film thickness
data on single and multiple layers of oxide, nitride, photoresist, and
polysilicon on a variety of substrates.
TESTER (FILM THICKNESS REFLECTOMETER)
The Film Thickness Reflectometer (tester of FTR) includes the wafer
positioning and wafer imaging subsystems. The wafer positioning
subsystem includes the wafer stage and its associated motors and
controllers. The wafer imaging subsystem includes all the optical
components of the system and the associated electronics. The tester
uses an internal microprocessor to control stage movement and perform
measurements by command from the SpectraMap system Controller.
WAFER HANDLER
The Auto SM300 system includes an H2 wafer handler. The handler
automatically transfers wafers between the tester and one or two
cassettes containing up to 26 wafers each. Non-Contact flat aligner
finds and aligns the major flat or notch on each wafer. Adiagnostics
panel or H2D standalone software enables you to control and calibrate
the wafer handler manually and to test and monitor mechanical functions.
Specifications:
Wafer Sizes: Standard 100, 125, 150 and 200mm
Carrier Types: Standard H-Bar cassettes (up to 26 slots)
Wafer Alignment: Repeatable to +/- 200um in X and Y and +/- 1 degree in 0
Interface: Optional remote SECS II via system
Power: 110/220V, <2A, 50/60 Hz, 235W maximum
Vacuum: 500mm (20 inches) Hg constant vacuum
OPTICAL MEASURING
Measures single and multilayer Films
Plot & die map data output formats:
Contour map, diameter scan map & 3-D
Thickness Range 200 angstroms to >4 microns for oxide and nitride films
Minimum thickness of 500 Angstroms to >4 microns for photoresist and polysilicon films
Calibration settings stored for up to 60 Types of wafers
Up to 1264 Test Sites per wafer
Price: Inquire
Ref# 36365ke
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